Collaborative project demonstrates the success of advanced generative design software and copper 3D printing, unlocking potential for efficient heat management.

Redefining thermal management, ToffeeX, in collaboration with Imperial College London and the University of Wolverhampton, has unveiled a groundbreaking approach to heat sink design through advanced metal 3D printing and cutting-edge modeling software, setting a new benchmark for efficiency in the aerospace and advanced manufacturing sectors.

For decades, the pursuit of better thermal management has been constrained by the limits of conventional design and manufacturing techniques.

The primary solution to managing excess heat in critical systems has long been the use of heat sinks. These essential components work by dissipating heat in sensitive electronics or machinery, maintaining optimal performance, and preventing overheating – essentially, a block of metal that absorbs and carries heat away from delicate parts.

Yet, the design and manufacturing of traditional heat sinks have created a pressing need for a new approach to meet the demands of advancing performance and efficiency.

At the forefront of this problem has been ToffeeX, working alongside leading academic institutions to push the boundaries of performance and efficiency through a bold integration of cutting-edge modeling and advanced 3D printing methods.

Beginning years ago, with foundational research at Imperial College London, ToffeeX's generative design software emerged as a transformative tool for optimizing complex engineering challenges.

Partnering with the University of Wolverhampton, renowned for its expertise in additive manufacturing, the collaboration culminated in the 14-month Multiscale Optimization Framework for Aerospace Cold-Plates (MOfAC) project, launched in September 2023.

Over the course of the project, the team tackled long-standing barriers in thermal design by combining their expertise in additive manufacturing and advanced modeling, culminating in the successful creation of the first-ever test specimen – a copper heat sink designed to balance optimal heat transfer with minimal energy loss.

Not to be understated, this copper heat sink is more than that. Created using high-purity powdered copper and a metal 3D printing method called laser powder bed fusion (LPBF), a technique that uses a laser to gradually fuse layers of powdered metal. – showcasing an unprecedented level of precision and complexity in design while capitalizing on the exceptional thermal conductivity of copper to achieve unparalleled cooling performance.

Overcoming copper's inherent challenges, such as its high reflectivity and susceptibility to oxidation, the team leveraged advanced manufacturing techniques to engineer a thermally superior material viable for aerospace, electronics, and other demanding industries.

ToffeeX

"Working with ToffeeX, and Imperial College London pushing the boundaries of L-PBF copper printing and heat sink design highlights the potential of additive manufacturing and thermal management," said Arun Arjunan, director of the University of Wolverhampton's Elite Centre for Manufacturing Skills and Centre for Engineering Innovation and Research. "By combining our expertise in advanced materials and 3D printing technologies, we will continue to develop innovative solutions that meet the growing demand for efficient thermal management systems across various industries."

Although performance data for the latest copper heat sink iteration is not yet available, previous applications of ToffeeX's generative design software offer a glimpse into its transformative potential.

In a 2022 collaboration with Ricoh, the optimization of aluminum heat sinks using ToffeeX's algorithms and a different metal 3D printing technology – binder jetting – resulted in a 31% increase in thermal efficiency.

While this earlier project involved different materials and methods, it underscores the effectiveness of ToffeeX's design framework in significantly improving heat sink performance. Applied to high-purity copper – a material with superior thermal conductivity – these advancements could herald a new standard in thermal management, pending further validation.

"ToffeeX is proud to lead this innovation in collaboration with Imperial College London and the University of Wolverhampton," said ToffeeX senior engineer Nicholas Raske. "This partnership exemplifies the power of interdisciplinary teamwork, where cutting-edge manufacturing and research expertise merge to address critical engineering challenges. Multiscale modeling and copper 3D printing capabilities are reshaping what's possible in engineering, providing faster, better, and greener solutions for thermal management."

The MOfAC project may have concluded, but ToffeeX and its partners are just getting started. Building on the success of its multiscale modeling framework and cutting-edge 3D printing techniques, ToffeeX is looking to scale production capabilities and refine processes.

This ongoing innovation promises to unlock even greater performance in thermal management, with plans to expand their applications across industries that demand top-tier cooling solutions.

From cooling next-generation supercomputers to managing heat in electric vehicles and hydrogen fuel cells, ToffeeX's advancements stand ready to transform how industries handle thermal challenges.

With aerospace and advanced manufacturing as its proving grounds, the potential for these technologies to reshape sectors dependent on precision thermal control is enormous. By bridging the gap between innovation and practicality, ToffeeX is setting a new gold standard for the future of heat management.